English | 中文 | Español

Bisphenol A Diglycidyl Ether Epoxy Resin

CAS No.:25068-38-6
Product Grade: Industrial Grade
Purity / Assay: 98.0% min
Molecular Formula:C₁₈H₂₁ClO₃
Molecular Weight:320.8151 g/mol
Synonym(s):Bisphenol-A-Diglycidyl-Ether-Epoxy-Resin; BisphenolADiglycidylEtherEpoxyResin

Bisphenol A Diglycidyl Ether (DGEBA), identified by CAS 25068-38-6, represents the most widely utilized class of epoxy resins in the global chemical industry. This liquid resin is synthesized through the reaction of epichlorohydrin and bisphenol A, resulting in a clear to amber viscous liquid characterized by its high epoxide content and excellent chemical stability. Its molecular structure provides a unique balance of reactivity and mechanical performance, making it a foundational component for high-performance thermosetting systems.

In industrial and research contexts, DGEBA is valued for its exceptional adhesion to various substrates, including metals, glass, and ceramics. When combined with appropriate curing agents such as amines, polyamides, or acid anhydrides, it undergoes a cross-linking process to form a rigid, durable polymer network. Proper handling is essential, as the material is sensitive to temperature variations and requires precise mixing ratios to achieve optimal physical properties in the final cured state.

• This resin serves as a primary binder in high-performance protective coatings and industrial flooring systems. Its superior chemical resistance and low shrinkage during curing make it ideal for anti-corrosive primers and heavy-duty marine coatings that must withstand harsh environmental conditions and chemical exposure.

• In the field of structural adhesives, DGEBA is a critical ingredient for formulating high-strength bonding agents used in the aerospace, automotive, and construction sectors. It provides exceptional shear and peel strength, allowing for the reliable assembly of dissimilar materials such as metal-to-composite or glass-to-metal interfaces.

• The electrical and electronics industries utilize this epoxy resin for potting, encapsulation, and the fabrication of printed circuit boards. Its excellent dielectric properties and thermal stability ensure the protection of sensitive electronic components from moisture, mechanical shock, and electrical interference.

• It is extensively employed in the production of fiber-reinforced composites, including those used in wind turbine blades, sporting equipment, and lightweight automotive parts. The resin’s ability to thoroughly wet reinforcing fibers like carbon or glass ensures a high-strength composite structure with excellent fatigue resistance.

25kg/bag, 25kg/drum, 500kg/bag
CAS No.: 25068-38-6

Product Name: Bisphenol A Diglycidyl Ether Epoxy Resin

Purity / Assay:98.0% min
Molecular Formula:C₁₈H₂₁ClO₃
Molecular Weight:320.8151 g/mol
Synonym(s):Bisphenol-A-Diglycidyl-Ether-Epoxy-Resin; BisphenolADiglycidylEtherEpoxyResin

For global customers, we provide complete technical documentation to support product evaluation, regulatory compliance and safe handling during transportation and application.

REQUEST A QUOTE

Product Inquiry — Popup Form